AMD Socket AM5
Supports AMD Ryzen 7000/ Ryzen 8000 Series Processors
Unparalleled Performance
Direct 8+2+2 Phases Digital VRM Solution
Dual Channel DDR5
4*SMD DIMMs with AMD EXPO & Intel XMP Memory Module Support
SuperSpeed Storage
1*PCIe 5.0 x4 + 2*PCIe 4.0 x4 M.2 Connectors
Advanced Thermal Design & M.2 Thermal Guard
To Ensure VRM Power Stability & 25110 M.2 SSD Performance
EZ-Latch
PCIe x16 Slot with Quick Release Design
Fast Networks
2.5GbE LAN & Wi-Fi 6E 802.11ax
Extended Connectivity
DP, HDMI, Rear USB-C 10Gb/s, Front USB-C 20Gb/s
Smart Fan 6
Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
Q-Flash Plus
Update BIOS Without Installing the CPU, Memory and Graphics Card
Durable Performance
GIGABYTE Ultra Durable™ motherboards built with optimal components inside out provide the prime performance and timeless platform.
Digital VRM Design
8+2+2 Phases Digital VRM Solution
GIGABYTE UD series motherboards use a 8+2+2 phases digital PWM design to support AMD's new generation CPU by offering incredible precision in delivering power to the motherboard's most power-hungry and energy-sensitive components as well as delivering enhanced system performance and ultimate hardware scalability.
DDR5 EXPO & XMP Overclocking Up to 8000 and Beyond
GIGABYTE is offering a tested and proven platform that the memory overclocking capability is able up to 8000 and beyond. All users need to do for achieving this extreme memory performance boost is to ensure that their DDR5 memory modules are AMD EXPO/Intel XMP capable, the EXPO/XMP function is activated and enabled on their GIGABYTE motherboard.
Fully Covered MOSFET Heatsink
3X Large Surface
Increased surface area up to 3X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.
Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors' multi-piece design.
Future Connectivity
The ultimate connectivity with blazing data-transfer speeds through the next generation network and storage.
802.11ax Wi-Fi 6E
The latest Wireless solution 802.11ax Wi-Fi 6E with new dedicated 6GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.
2.5GbE LAN
Supercharge your gaming with 2.5GbE LAN Achieve lightning-fast speeds, minimal lag, and unbeatable performance to elevate your gaming setup and dominate the competition.
PCIe 4.0 Hardware Design
GIGABYTE B650 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience twice bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.
Hi-Fi Audio
High-End Audio Capacitors. GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.
Audio Noise Guard
GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.
Bluetooth:
tak
Category Code:
MBA
Chipset:
AMD B650
CnCode:
84733020
DDR3 1600/1333/1066/800:
B650 GAMING X AX V2 1.2
DDR3 1601:
3
Form Factor:
ATX
Głębokość opakowania wysyłkowego:
57.9 cm
Gniazda pamięci:
4
Gniazdo elektryczne:
SAM5
IEEE 802.3ak:
1
Ilość w opakowaniu:
8
Jednostkowa waga brutto:
2.14 kg
Jednostkowa waga netto:
2 kg
Kamera:
Tak
M.2:
3
Manufacturer:
GIGABYTE
MT-RJ:
1
Objętność brutto:
0.0102 cubm
Objętość jednostki brutto:
1
PCI-Express 16x:
1
Prędkość częstotliwości:
4400/4800/5200/5600/6000/6200/6400/6600/6800/7000/7200/7600/7800/8000 MHz
PS/3:
1
RAID:
SATA 0, 1, 10; NVMe 0, 1, 10
RJ46:
1
SATA:
Tak
Seryjny:
Tak
Szerokość opakowania wysyłkowego:
37.2 cm
TPM:
Nagłówek
Typ pamięci:
DDR5
Unit Box Height:
0.334
Unit Box Length:
0.271
Unit Box Width:
0.081
USB 2.1:
3, Tak
USB 3.2:
4, Tak
USB type C:
1
USB-C:
Tak
Waga opakowania wysyłkowego:
17.15 kg
Wysokość opakowania wysyłkowego:
37.9 cm
Zintegrowane video:
W zależności od procesora
Zintegrowany LAN:
2.5 Gigabit